Utari, Listya (2015) PENUMBUHAN LAPISAN FILM TEBAL Ag, Pd/Ag, DAN Au DENGAN MENGGUNAKAN METODE SCREEN PRINTING YANG DIAPLIKASIKAN SEBAGAI MIKROSTRIP BANDPASS FILTER. S1 thesis, Universitas Pendidikan Indonesia.
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Abstract
Telah dilakukan pembuatan film tebal Ag, Pd/Ag, dan Au untuk aplikasi bandpass filter dalam bentuk mikrostrip dengan metode screen printing Penelitian dilakukan dengan membuat 3 bandpass filter dengan masing-masing menggunakan pasta Au, Ag dan Pd/Ag. Bandpass filter dibuat dengan rancangan agar mampu bekerja pada frekuensi tengah 456 MHz, bandwidth 60 MHz, VSWR 1 dan loss -93,55 dB. Karakterisasi SEM, EDS dan FTIR dilakukan untuk mengetahui morfologi dan kandungan mikrostrip bandpass filter. Sedangkan untuk mengetahui unjuk kerja bandpass filter dilakukan pengujian dengan menggunakan VNA. Hasil SEM menunjukkan ukuran butir dengan pasta Au, Ag dan Pd/Ag masing-masing yaitu 0,435 nm, 0,389 nm, dan 0,913 nm. Serta ketebalan jalur konduktor masing-masing yaitu 10,47μm, 13,96μm dan 14,15μm. Berdasarkan hasil SEM menunjukkan pori-pori tersebar pada permukaan mikrostrip sehingga meningkatkan nilai loss bandpass filter. Hasil EDS dan FTIR menunjukkan adanya pengotor C, N, O, H dan Al pada jalur konduktor mikrostrip. Pengukuran ketiga bandpass filter dengan VNA memperoleh hasil yaitu frekuensi tengah 456 MHz, bandwidth 60 MHz, loss 3 dB, dan VSWR 1,3. Hasil fabrikasi memiliki nilai VSWR dan loss yang lebih tinggi dibandingkan dengan rancangan, karena adanya conductor loss akibat pori pada permukaan mikrostrip dan unsur pengotor. Kata Kunci: Bandpass Filter, Mikrostrip, Strip Konduktor, Teknologi Film Tebal. A study on fabrication of thick film Ag, Pd/Ag, and Au for microstrip bandpass filter application using screen printing method has been carried out. Research carried out by making three bandpass filter using conductor paste Au, Ag, and Pd/Ag. Bandpass filters are designed at the operating center frequency 456 MHz, bandwidth of 60 MHz, 1 VSWR, and -93.55 dB loss. SEM, EDS and FTIR characterization conducted to determine morphology and content of microstrip bandpass filter. Meanwhile, the performance of bandpass filter was examined by using VNA. SEM results indicate grain size conductor strip using Au, Ag, and Pd/Ag are 0.435 nm, 0.389 nm and 0.913 nm. The thickness of each conductor strips are 10,47μm, 13,96μm and 14,15μm. Based on SEM results showed pores scattered on the surface of conductor strip,that causes the value loss increases. EDS and FTIR results indicate the presence of impurities C, N, O, H, and Al on conductor strip of microstrip. The measurement of three bandpass filter with VNA get the results that the center frequency 456 MHz, bandwidth of 60 MHz, 3 dB loss and 1.3 VSWR. Fabrication results indicate the value of loss and VSWR, higher than the design. It was due to conductor loss that occurs due to pore on the surface microstrip and also due to the impurity. Keywords : Bandpass Filter, Microstrip, Conductor Strip, Thick Film Technology
| Item Type: | Thesis (S1) |
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| Additional Information: | No. Panggil: S_FIS_UTA p-2015; Pembimbing : I. Dewa Putu Hermida, II. Andhy Setiawan |
| Uncontrolled Keywords: | Bandpass Filter, Mikrostrip, Strip Konduktor, Teknologi Film Tebal. |
| Subjects: | L Education > L Education (General) Q Science > QC Physics |
| Divisions: | Fakultas Pendidikan Matematika dan Ilmu Pengetahuan Alam > Jurusan Pendidikan Fisika |
| Depositing User: | DAM staf |
| Date Deposited: | 26 May 2015 02:29 |
| Last Modified: | 26 May 2015 02:29 |
| URI: | http://repository.upi.edu/id/eprint/14603 |
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